Origin	Korea
Model Number	3000M
Brand Name	Global Active

3D Solder Paste Inspection Machine  3D SPI

Features :
Easy to use by fully motorize X-Y scan mechanism.
Easy to program by Gerber image navigator
Easy to repeat the same job by loading the saved program
User-friendly color image live view operation
Easy to monitor various 3D measurement data (Min./Max./Avg.
Height,volume data and 3D shape image)
Easytomeasure2DdatawithinF.O.V(distance&area)
More precise 3D data review by single cross-section profile
3D inspection function(Height/Volume/Coplanarity)
SPC software including various charts& reports
Warpage compensation

The Importance of True 3D Solder measurement

The key factors of solder paste quality are its height, volume
and shape.

2D images provide only color, brightness and area information
but not key factors..
3D measurement must be required to get information related
to height, volume and shape.
At least 50% defects of SMT manufacturing process occurs
only during printing.
The worse the quality of solder paste is,the more placement
defects occur.
The reliability of electronic products directly links to the solder
joint quality and the quality of solder joint is effected by solder
paste’s height, volume and shape.
Without 3D solder measurement,there is no way to check the
exact quality of printing.
The earlier defects are found, the less repair cost is required.

SMT DEFECT SPECTRUM OF THE PRINTING PROCESS

NO SOLDER
INSUFFICIENT SOLDER
EXCESSIVE SOLDER
BRIDGING   
50-60%

Most people put all the emphasis on the AOI machine to
detect the above defects which can  be controlled effectively
with a 3D SPI measurement system even before going
through the reflow process